Technical Activities

[skip navigation] NIST Physics Laboratory home page Technical Activities go to NIST home page NIST Physics Laboratory home page Products and Services Physical Reference Data Research Areas / Divisions Contact us Search the Physics Laboratory webspace
"Technical Activities 2002" - Table of Contents Division home page

Atomic Physics Division
The strategy of the Atomic Physics Division is to develop and apply atomic-physics research methods to achieve fundamental advances in measurement science relevant to industry and the technical community, and to produce and critically compile physical reference data.
GOAL: To determine
atomic properties
and explore their
applications
Strategic Focus Areas:
    First Light-Matter Interactions and Atom Optics  -  to advance the physics of electromagnetic-matter interactions and to explore new applications for laser cooled and trapped atoms.
Second    Plasma and X-Ray Measurement Methods  -  to develop advanced optical and x-ray measurement techniques for applications involving laboratory and space plasmas, thin-film structures, and nanoscale devices.
Third Nanoscale and Quantum Metrology  -  to advance measurement science at the atomic and nanometer scale, focusing on ultraprecise length-displacement measurements, x-ray and gamma-ray precision metrology, and nanooptics and nanosystems modeling.
Fourth Critically Evaluated Atomic Data  -  to produce reference data on atomic structure and to critically compile reference data for scientific and technological applications.
Plasma and X-Ray Measurement Methods:
to develop advanced optical and x-ray measurement techniques for applications involving laboratory and space plasmas, thin-film structures, and nanoscale devices.

INTENDED OUTCOME AND BACKGROUND

This strategic element focuses on the use of atomic radiation as an efficient, noninterfering probe of plasmas and industrially important materials. Our research includes sizable plasmas used for etching semiconductor wafers, small-scale plasmas confined in electromagnetic traps, and nanoscale plasmas induced on surfaces by individual, highly charged ions. Information is obtained by measuring the emitted photons and massive particles using a variety of instruments, including visible, ultraviolet, and x-ray spectrometers, microcalorimeters, mass spectrometers, submillimeter wave detectors, and spatial imaging systems. In addition, surface effects are analyzed at the atomic level using a scanning tunneling microscope and an atomic-force microscope.

Our plasma diagnostic research includes collaborations with industry, university, and government partners. For example, Intel and International SEMATECH have requested that the NIST electron-beam ion trap be utilized to assist in the development of EUV lithography light sources.

  Figure 3
Figure 3
We work with x rays since their weak interactions make them a nearly ideal penetrating probe. The primary goals of this research are the development and application of high-resolution x-ray scattering techniques, the production of reference samples of thin-film and multilayer structures, and the understanding of the microstructure of thin-film and multilayer structures appropriate to the semiconductor industry.

Following on our experience fielding a high-energy, curved crystal spectrometer at the OMEGA laser facility at the University of Rochester, we are presently producing a more ambitious, broadband, multichannel x-ray spectrometer system for the National Ignition Facility (NIF). These types of instruments will serve the plasma-diagnostic community by providing information about such things as the hot-electron energy distribution and the plasma temperature.

Figure 3. Reflection-geometry spectrometers constructed as a National Ignition Facility plasma diagnostic (top). Four convex, curved crystals [bent to five inches (11.7 cm) radius of curvature] together provide cascading high-resolution x-ray spectral coverage from 1 keV to 20 keV. The four crystals shown (bottom) are Potassium Acid Phthalate, Quartz, Silicon, and Germanium.

Accomplishments

  • Optical Properties in Support of UV Lithography

    Optical-lithography technology is growing to more rely upon deep- and vacuum-ultraviolet radiation in order to further extend the performance of advanced integrated circuits. This necessitates the use of crystalline fluoride materials for the refractive optics, though little was known of the optical properties of these materials at these short wavelengths.

      Figure 4

    Figure 4. Directional dependence of the spatial-dispersion-induced birefringence in calcium fluoride and related cubic materials, first calculated and measured as part of this project. The figure shows the previously-unknown heptaxial behavior (seven nonbirefringent axes) for this cubic system.

    In May 2001, we uncovered a very large, completely unexpected intrinsic birefringence in calcium fluoride at short wavelengths. Its index of refraction depends on the polarization of the incident light. Since then, the 157 nm lithography community has been struggling to find ways to design around this aberration.

    The NIST team continues to work on developing a new crystalline material that does not exhibit birefringence at 157 nm as one approach to ameliorate this problem. This material is based on mixed solid solutions of CaF2 and SrF2, which separately have opposite signs of the effect. Working with industrial partners for material growth, this new material is being grown and characterized.

    To establish the properties of this and other UV materials, NIST has developed a unique phase-shifting interferometer that can measure the index homogeneity and birefringence at wavelengths ranging from the visible through 146 nm (in the vacuum ultraviolet). It has enabled a determination of the dispersion of these properties in this complete wavelength range.

    An effort to characterize many materials and samples is being pursued to see if a scaling factor can be established which reliably provides the 157 nm values from the much more easily measured visible wavelength values.

    CONTACT: Dr. John Burnett
    (301) 975-2679
    john.burnett@nist.gov


  • Ion-Gas Recombination Studies

    Motivated by a growing interest from the fusion-energy and astrophysics communities, we have expanded the NIST Electron Beam Ion Trap facility to allow ion-gas collision studies. We have installed a gas-jet target and additional detectors on our ion beamline to study the photons that are emitted as the ions traverse the target.

    The new apparatus has yielded measurements on a sequence of charge states of krypton, starting at Kr27+ and extending through Kr36+. The study reveals systematic changes in x-ray wavelength and intensity ratios as a function of ion charge state. Particularly dramatic is an abrupt increase, by a factor of two, in the Lalpha/M ratio as the L-shell changes from single vacancy to multiple vacancy. A time-dependent collisional-radiative model of the excited-state population distribution confirms that the origin of this shift is the formation of metastable states.

    CONTACT: Dr. John Gillaspy
    (301) 975-3236
    john.gillaspy@nist.gov


  • Detection of Chemical Contamination in a Semiconductor Plasma-Etching Reactor

      Figure 5

    Figure 5 (© H. Mark Helfer).

    High resolution, submillimeter wavelength, linear-absorption spectroscopy has been developed as a tool for monitoring chemical contamination in plasma-etching reactors. Contamination may arise from feed-gas impurities, vacuum-chamber leaks, and incomplete chamber cleaning. The submillimeter methods are particularly sensitive to contamination originating from water vapor, which has an intense rotational transition at 557 GHz.

    We have measured this rotational transition in a Gaseous Electronics Conference (GEC) reference cell, installed at a commercial company, under three different reactor conditions prior to initiating a fluorocarbon plasma. The apparatus has demonstrated sensitivity levels less than 10 nmol/mol. Levels less than 1 nmol/mol should be possible.

    Figure 5. The GEC RF Reference Cell, a standardized plasma source designed to create plasmas similar to those found in commercial semiconductor etching reactors.

    CONTACT: Dr. Eric Benck
    (301) 975-3697
    eric.benck@nist.gov


  • A New Powerful Probe for High-Efficiency Lighting

    There are an estimated one billion plasma light sources in service in the United States, consuming an estimated 2 exajoules (600 billion kilowatt-hours) of electrical energy annually. These sources are principally fluorescent lamps and metal-halide discharge lamps. In the past, metal-halide lamps were used mainly for high-intensity lighting of large spaces. Now, because of their high brightness and energy efficiency, they are also being developed for automobile headlights and interior lighting.

    As a result, there is a growing interest in increasing their luminous efficiency through a better understanding of the processes that govern their operation.

    These processes are so complex that they have defied attempts at predictive modeling or even the development of scalable design rules.

    Figure 6

    Figure 6. Temperature distribution in a high-pressure lighting discharge as revealed by x-ray absorption imaging.

    As part of a cooperative program with the Electric Power Research Institute, NIST researchers have used x rays from the Advanced Photon Source at Argonne National Laboratory to develop a new generation of diagnostic methods for metal-halide lamps. Both x-ray absorption and x-ray fluorescence were used to map the distribution of the temperature and the various elemental components in a production-style lamp.

    The use of these techniques will enable lighting scientists and engineers to develop a more complete understanding of metal-halide arc lamps, leading to improved design rules, advanced production methods, and eventually, more energy-efficient lighting.

    CONTACT: Dr. John Curry
    (301) 975-2817
    john.curry@nist.gov


First strategic focus   |   Second strategic focus   |   Third strategic focus   |   Fourth strategic focus

"Technical Activities 2002" - Table of Contents